Smarter. Faster. Future-ready.

cyberTECHNOLOGIES is redefining semiconductor metrology – combining precision-engineered hardware with intelligent software for unmatched performance in both front-end and back-end processes.

From wafer-level to advanced packaging, our systems deliver nano-resolution data where it matters most. Metrology solutions for a wide range of semiconductor applications, including:

  • Front-End: Wafer Bow/Warp, Thickness Variation (TTV, LTV), Thin Film Metrology

  • Back-End: Advanced Packaging, Bumps, Wirebond, Thermal Warpage

  • Panels: Warpage, Thickness, TGV/TSV, Position Accuracy, Dimensional Measurements

…and much more.

Trusted by leading international corporations, institutes
in research, development and production.

Applications

Our metrology systems are used for a wide range of applications requiring micrometer or nanometer accuracy. A breif selection:

Discuss your metrology needs and applications to find the ideal configuration for you.​​

Sophisticated Software

Our software offers manual analysis tools as well as fully automated metrology solutions and advanced production environment software. Software development is one of our core competences to ensure optimal performance and maximum flexibility.

Manual measurement and analysis software. Featuring over 500 built-in analyses and data operations. Designed to help you focus on what matters most to you with ease.

The automation software for your measurement and analysis. Easily create measurement programs with just some clicks. Production ready and optional with SECS/GEM support.

Production software for our fully automized metrology systemes (AL-series) including sample handling. Optimized for cleanroom environments with touch control, great overview of measurements, results and systems status and optional SECS/GEM support.

Service & Support

Need assistance? Contact our experts for support with your measurement system or any questions regarding your application and new metrology challenges.

Latest News

cyberTECHNOLOGIES is proud to sponsor this year's Chiplet Summit 2025 in Santa Clara, where we will showcase our latest metrology solutions focued on chiplets.
From November 12th to 15th, we’re focusing on metrology for the semiconductor industry. Meet our experts and experience our latest metrology systems live in action.
Exciting times at Hashtag#CIOE 2024 in Shenzhen, China! The event has officially started, and we’re thrilled to be part of it.