AL 200S
High-Throughput Wafer Metrology
Measurement and Analysis Modes
Fully Automated
including Handling
Measurement Area
up to 250 x 250 mm²
single or double-sided
Measurement
Step Height, Flatness (Bow, Warpage), Coplanarity (Bumps, Plugs), Thin Film, Lasermarks and many more
Fully Automated
Metrology Cell
The AL 200S integrates a CT300 or CT350T unit with a wafer handling system, supporting wafers from 4” to 8”. This design maximizes throughput and can be used for a wide range of front-end applications.
Technology for Throughput
The AL-Seriers combines a wide range of optical sensors technologies with handling system t
For a wide range of applications in production and R&D. Choose from five optical sensor technologies for high-resolution down to 0.1 nanometer or high-speed measurements with up to 36 million datapoints per second. Add great flexibility with a combination of multiple sensors and objectives in one single system.
Precise lateral movement on a measurement area of up to 250 x 250 mm². The XY stage, available for single-sided or double-sided measurements, combined with a 50 Nm encoder, ensures pinpoint accuracy for every measurement. Enabling precise positioning and detailed lateral measurements of features. Optionally extend the stage with a lift-pin vacuum chuck or customized interface.
The automated wafer handling system, available with single or dual-arm configurations, can be customized with various endeffectors to suit your specific needs. It also includes wafer prealignment and cassette mapping, ensuring precise processing from the start.
Precise lateral movement on a measurement area of up to 350 x 350 mm². The XY stage, available in 315 mm² or 350 mm², combined with a 50 Nm encoder, ensures pinpoint accuracy for every measurement. Enabling precise positioning and detailed lateral measurements of features. Optionally extend the stage with a vacuum chuck or interface for manual or automated loading.
Available Sensors
Flexible high-speed measurements on almost any material with a z-resolution down to 3 nm.
Thickness measurement with a resolution down to 1 nm.
Measure step heights or features with a z-resolution down to 1 nm.
With a z-resolution of down to 0.1 nm for smooth surfaces or smallest (step) heights.
Fast and high-accurate thin film measurement down to 10 nm.
For precise and fast position and lateral measurements with up to 235 MP.
Get the best configuration for your specific needs.
Sophisticated Software
Application Examples
The adaptable multi-sensor metrology cell allows it to be customized to support a wide range of applications. It enables precise quality control, automated sample handling, measurement and fast analysis. Delivering reliable performance for each unique need. This flexibility makes it an ideal solution for any application demanding high-resolution metrology and operational versatility.
(Step) Height and Critical Dimensions
Positions, Parallelism
Absolute Thickness and Variations (TTV, LTV)
Options
The modular design of the AL-series allows for seamless expansion with a variety of upgrade options. Here’s a quick overview of options to enhance your system’s capabilities.
Lift-Pin Chuck
Additional Magazin Slot
Expand your system with additional magazine slots, allowing you to process a higher volume of wafers without the constant interruption of loading and unloading. This upgrade maximizes efficiency and streamlines your wafer handling operations.
Calibration Targtes
A broad selection of calibration targets that can be directly integrated into the system, enabling a fully automated calibration and certification process.
Let's discuss your needs to find the best solution for you.
General
cyberTECHNOLOGIES GmbH
Georg-Kollmannsberger-Straße 3
85386 Eching-Dietersheim
Germany