Systems Overview

We offer a broad spectrum of optical metrology systems, combining high-resolution non-contact technologies with intuitive manual and automated software for unmatched flexibility in R&D and production.

Table-Top

The VANTAGE series delivers precise and accurate height and thickness measurements in a compact design, perfect for both R&D and production environments.

VANTAGE 1

Compact 2D Profilometer

VANTAGE 2

Compact 3D Profilometer and Interferometer

Advanced Metrology

The CT-series offers unmatched flexibility where you need it most. With its multi-sensor design, it seamlessly integrates up to six different sensor technologies into a single system. Plus, its advanced automation takes efficiency to the next level.

CT 150

Compact metrology system for production or advanced R&D with a scanning area of 150 x 150 mm².

CT 300

Versatile Metrology System for Production & Laboratory with a scanning area of up to 315 x 315 mm².

CT 350

Versatile Metrology System for Production & Laboratory with a scanning area of up to 350x 350 mm².

CT 350T

Double-Sided Metrology System for Production and Laboratory use, measuring absolute thickness and top/bottom surfaces in one scan, on areas up to 329 x 329 mm².

CT 450G

Advanced Metrology System for large and heavy parts in production or R&D.

CT 600S

Leading accuracy on larger scale for samples up to 650 x 650 mm² and beyond.

CT 600ST

Double-Sided Metrology System for large parts up to 650 x 650 mm².

Full Automated

The AL-series merges the power of one or two CT300 or CT350T units with advanced automated wafer handling, specially engineered for front-end applications. Designed to push the limits of throughput and to boost your yield.

AL 200S

Fully automated wafer metrology with single or double-sided measurement capabilities, complete with seamless handling. Enhance precision and efficiency in your wafer processing and boost your Yield.

AL 200D

Fully automated wafer metrology solution, featuring high-throughput, dual-arm handling and both single and double-sided measurement capabilities with two simultaneously measuring metrology cells. Designed for precision and efficiency, this system streamlines your wafer processing.