Applications
Analysis for a wide range of applications.
Measure Flatness, Bow, Warp and more of substrates, wafer or any other sample.
Measure R-parameters (e.g. Ra, Rz) in 2D or S-parameters (e.g. Sq, Smax) in 3D.
Measure coplanarity with seating or regression plane, local heights of pins, pads, bumps, connectors and more.
Measure and analyze heights on a global or local scale, from microns down to nanometers.
Measure the thickness of transparent layers or the top surface.
Absolute thickness, thickness variations (TTV, LTV), parallelism or compare positions of features from top to bottom surface.
General
cyberTECHNOLOGIES GmbH
Georg-Kollmannsberger-Straße 3
85386 Eching-Dietersheim
Germany