Measure and analyze (absolute) thickness, thickness variation (TTV, LTV) and compare top to bottom surface of your products and samples.
Measure and analyze thickness with single-sided systems for materials like glass or silicon or use our double-sided systems for comprehensive analysis on almost all materials.
Measure your samples in 3D of sizes up to 600 x 600 mm² to analyze absolute thickness (average, maximum, minimum) and thickness variations (TTV, LTV) down to sub-micron accuracy.
Perform fast 2D TTV measurements enabling you to analyze both the thickness (blue profile) as well as the detailed structure of the top (red profile) and bottom (green profile) surfaces in a single scan.
Accurately verify the positions of features and structures with automated feature detection on both the top and bottom sides of your product, capturing alignment and orientation in a single scan. Use automated programs with ASCAN to confirm that any offsets remain within specified tolerances.
The CT-system offer versatile thickness measurement capabilities, providing options for single-sided or double-sided measurements that include detailed data from both the top and bottom surfaces.Â
Measure absolute thickness, thickness variations (TTV, LTV) and both top and bottom surfaces on almost all materials. Thanks to double-sided chromatic confocal sensors, our T-systems delivers sub-micron level accuracy. For high-speed applications line sensors are available, measuring up to 1 million data points per second.
System equipped with an infrared interferometer can measure the thickness of materials transparent to infrared light, such as glass or silicon. Achieving z-resolutions down to 1 nanometer with measurement speeds of up to 70,000 points per second.
Our metrology systems are designed to measure thickness across a diverse range of products and samples.
Measurement of double-sided waviness, parallelism, thickness and thickness variation with sub-micron accuracy.
Measurement of a non-transparent foil to identify positions and detect thickness variation for subsequent production steps.
Accurately measure the flatness of your samples, including detailed analysis of warp and bow deformations. Whether you need to assess surface uniformity or detect subtle curvatures, our analysis ensures accurate, reliable results.
Measure roughness on various materials and perform detailed analysis in both 2D (R-parameters) and 3D (S-parameters). All in accordance with DIN and ISO standards.
cyberTECHNOLOGIES GmbH
Georg-Kollmannsberger-Straße 3
85386 Eching-Dietersheim
Germany
To provide the best experiences, we use technologies like cookies to store and/or access device information. Consenting to these technologies will allow us to process data such as browsing behavior or unique IDs on this site. Not consenting or withdrawing consent, may adversely affect certain features and functions. Privacy Policy