Coplanarity

High-speed, non-contact coplanarity measurement on balls, pins, pads
and more.

Detect smallest height differences

Coplanarity is essential for many products. Accurately measure and analyze bumps, balls (BGAs), pins (PGAs), pads (LGAs), leads, SMDs and other electronic components for coplanarity using a seating or regression plane analysis.

COPLANARITY

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Coplanarity Analysis

All bumps, leads, pads or any features can be detected automatically based on height, reflectivity or by importing coordinates.

Coplanarity (Regression plane)

Analyze coplanarity based on regression plane following JEDEC specification and diameter in one single measurement.

Coplanarity (Seating Plane)

Coplanarity based on the seating plane is calculated by defining a plane created by the three highest points that surround the center of gravity while avoiding intersection with other components. All this is done automatically and the center of gravity can be easily adjusted if needed.

(Local) Height

The height of each feature (e.g. bump) is measured precisely in relation to its direct surroundings. This approach ensures that height measurements are accurately determined relative to the designated reference, providing precise and consistent data for each single feature.

Position

Accurately measure the position of each bump or feature, with the flexibility to reference these measurements against imported nominal values, the best-fit grid or as absolute positions.

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Non-Contact Measurement

Our metrology systems offer a wide range of optical sensor technologies, enabling measurement capabilities at nanometer-level resolution. For coplanarity measurements chromatic confocal sensors, confocal microscopy or white light interferometry can be used.

Chromatic Confocal Sensor

Chromatic confocal sensors capture millions of measurement points per second with Z-resolution as fine as 3 nanometers. They are ideal for coplanarity measurements and work effectively on nearly any material, whether highly reflective or low-reflective. This makes them a top choice for fast, accurate measurements over small and large surface areas.

Confocal Microscope

Measure and analyze small bumps with resolutions down to 1 nanometer. Easily switch between different field of view of views and resolutions using an automatic objective turret for seamless objective changes in manual and automatic mode.

3D White Light Interferometer

White Light Interferometry (WLI) is highly effective for measuring small bumps due to its exceptional Z-resolution, reaching as fine as 0.1 nanometers. This capability allows the WLI to detect minute height variations, which is essential for accurately characterizing tiny bumps and surface irregularities.

Examples

The metrology systems can be used to measure a wide variety of products and samples for coplanarity. A breif selection.

Bumps on Wafer

Measure an entire wafer with bumps to evaluate coplanarity, analyze (local) height variations and the height distribution across the wafer.

Pads

Measure the coplanarity of pads efficiently, whether examining the height of individual pads or multiple pads at once.

Connectors, Pins

Measure the coplanarity of connectors, whether individually or multiple connectors simultaneously, with the ability to zoom in on each pin as needed for detailed analysis.